Introduction
HA-4900U is a hydrocarbon-based cleaner. Significantly lower odors than conventional detergents!
Advantages of HA-4900U
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Low odor
HA-4900U is consisted without 22 substances causing offensive odors and amine, aldehyde, etc., and has no unpleasant odors compared with conventional cleaner. |
High cleaning property
Specially formulated cleaner HA-4900U will strongly remove solder paste from stencils after printing. |
Easy to use
Since HA-4900U is free from nonvolatile ingredients, rinsing after cleaning is not necessary, and it can be easily wiped off with a waste cloth. |
Less damage to stencils / masks
HA-4900U is consisted of neutral components and does not damage the metal surface. |
Low toxicity
HA-4900U does not contain halogen-based solvents (chlorine, bromine, or fluorine-based) or highly toxic ingredients (toluene, xylene, IPA, etc.). |
General characteristics
| Main component |
Hydrocarbon-based |
| Specific gravity |
0.8 |
| Boiling point |
150℃ or more |
| Flash point |
43℃ |
| UN Class |
3 |
| UN No |
1993 |
| Packing Group |
Ⅲ |
| Packaging |
14kg/UN can |
Related articles and products
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Products information
- Metal / screen mask cleaner, HA series
- Can be used by hand or fed into cleaning equipment! A wide range of products are prepared for different types of pastes and adhesives!
It is also a great alternative to IPA.
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Products information
- [Long seller] Stencil cleaner, HA-1040U
- The high dissolving power of the cleaning agent cleans even the smallest openings.
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PCB Mounting Columns
- Printing process and trouble with metal stencils
- In the reflow process of electronics packaging, the most common method of supplying solder is to print solder paste using a metal mask. This section introduces the explanation of metal masks, the printing process, possible problems and cleaning.
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Trouble solution
- "Cleaning" in Electronics industory
- Cleaning related to the mounting process is explained using the example of the double-sided mounting process, in which inserted components are mounted (flow process) after surface mounting (reflow process) .
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