Introduction
KakenClean DF-series is water-based cleaner and strongly remove flux stuck onto each parts of reflow oven and other type of oven.
KakenClean DF-series can be used not only for cleaning reflow oven or each parts of oven, but also conveyor chain of wave soldering, carrier (Carrier pallets) or spraying fluxer.
Advantages of KakenClean series
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Low odor
KakenClean DF-series does NOT have unpleasant odor, realizing comfortable work environment. |
Splendid cleaning property
KakenClean DF-series is specially blended cleaner, which has three times as much flux dissolving property as IPA, though it is water-based cleaner.

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Spray cleaning
KakenClean DF-series is in spray bottle and flux will be easily dissolved by wiping after spraying to flux and leave it for a few minutes.
We have also added refillable and concentrated types to our product lineup.
Depending on the degree of contamination and the size of the workpiece, you can use KakenClean series in immersion cleaning or ultrasonic cleaning. |
Low toxicity
KakenClean DF-series is glycol and water-based cleaner, and does NOT include any toxic ingredients like halide solvent (i.e. chlorine, fluorine or bromine-based), toluene, xylene and IPA. |
Movies
Flux dissolving comparison
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This video compares the solubility of IPA and KakenClean DF-99U using a flux mass collected from actual reflow oven parts (scraped flux that has accumulated in a reflow oven that has not been cleaned for a long time). |
KakenClean Cleaning Demonstration ~Reflow furnace parts~
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Actual reflow oven parts were immersed in DF-99U for cleaning.
Simply soaking the parts in DF-99U is sufficient for cleaning, but when combined with ultrasonic waves, the flux dissolves so smoothly. |
KakenClean Cleaning Demonstration ~Reflow furnace parts 2~
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This time, the cleaning experiment was conducted on a larger part with more flux than the first part. Since KakenClean has no flash point, it can be used in combination with ultrasonic cleaners. Reflow oven parts can be cleaned in a few minutes not only by immersing in Rocklin but also by using ultrasonic waves. |
General characteristics
*Refill type (18kg/UN can) and conc. type (17kg/UN can) is also available.
Related articles
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Trouble solution
- "Cleaning" in Electronics industory
- Cleaning related to the mounting process is explained using the example of the double-sided mounting process, in which inserted components are mounted (flow process) after surface mounting (reflow process) .
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PCB Mounting Columns
- Soldering method in component mounting process
- Mounting (component mounting) in the electronics industry refers to soldering electronic components such as semiconductor devices and IC chips to printed circuit boards, etc., and electrically connecting terminals and wiring to make them ready for operation. This page introduces typical mounting processes such as reflow and wave soldering process.
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