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Carrier pallet cleaning system PALLETCLEANER PCLT

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Introduction

The Pallet Cleaner PCLT is a system for cleaning flux from carrier pallets used in the flow soldering process (sometimes referred to as carriers, flow pallets, etc.).
PCLT uses a shower system instead of ultrasonic or brush cleaning, which may deform the pallet opening.

Advantages of PALLETCLEANER PCLT



Multiple pallet cleaning
Up to 15 flow pallets (carrier pallets, solder pallets) up to 400mm square can be fed into the system.

Large opening
The opening size is 760x440mm and the door opens wide for easy loading and unloading of pallets.
The pallet stand can also be removed to allow cleaning of large reflow parts.

Simple liquid exchange
When draining, simply place an empty can of PARELECTRIN, a special cleaning agent, in the drain port and drain without getting your hands dirty.

100V power supply
The unit can be started up using only a 100V power supply, eliminating the need for a 200V power supply and making it easier to install!

Low cost
More affordable than conventional pallet cleaners!

System introduction

The newly developed Pallet Cleaner PCLT can clean not only pallets but also parts in the reflow oven. How much flux (fouling) deposited on a large part (approx. 30cm x 50cm) can be cleaned in just 30 minutes? Please take a look!

PALLETCLEANER Specification

Model PCLT
Machine dimensions W950×D500×H1,250mm
Opening size

760x440mm

☆PCLT can clean up to 400mm square pallets.

Power input Single phase 100V

Designated cleaning liquid KakenClean series

Product No. KakenClean DF-555U refill. KakenClean DF-99U refill. PALLETCLEAN PA-3200U
Main component Glycol, water Glycol, water Hydrocarbon, Water
UNRTDG UN class : Class 8
UN No. : 3267
PG : Ⅲ
UN class : N/A
UN No. : N/A
PG : N/A
UN class : N/A
UN No. : N/A
PG : N/A
Packing 18kg/UN can 18kg/UN can 12kg/UN can

Related articles and products

Trouble solution
"Cleaning" in Electronics industory
Cleaning related to the mounting process is explained using the example of the double-sided mounting process, in which inserted components are mounted (flow process) after surface mounting (reflow process) .

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